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2024年斯图加特工业胶粘技术展览会

2023-08-07 18:59166
  • 日期:2024-10-08~2024-10-11
  • 城市:斯图加特
  • 展馆:斯图加特国际展览中心
  • 主办:德国P.E. Schall 展览有限公司
  • 展会详情
    • 斯图加特工业胶粘技术展览会BONDexpo展是国际工业粘接技术专业展览会,是推进工业粘接技术发展的博览会议,是由P. E. Schall GmbH & Co. KG组织主办,从2007年开始举办,每年一届,与国际安装及使用技术专业展览会-Motek展在德国斯图加特国际展览中心同时举行,吸引更多的专业观众参与。

      BONDexpo正变得越来越重要,因此,特别是在事实的事项涉及的紧固件和新材料加入光已经代表了真正的粘接技术的挑战,并将继续这样做,将来也是如此。毕竟,轻质结构不仅是汽车的问题,而是设备和装置,以及一般应用的需要。未来的材料和材料组合,以及混合解决方案,将提供简化和资源潜力,只能通过采取新的粘合剂的使用优势。第四届BONDexpo将调解的国家的最先进的和当前的诀窍之间研发,实际使用和材料的应用。

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      展会数据:BonDexpo 2012举行第六次参展企业稳步增长达122家;BONDexpo于2011年是第五次举行,共106家企业参展。2009年展会回顾,有1100多家参展商,来自超过21个国家的观展者,总展览面积37,500平方英尺,展会平台是制造商和供应商在粘接,绝缘,发泡,密封和封装材料,以及应用设备等联系的最佳平台,并处理在各自的应用,正变得越来越密切的关系。2010年展有100家参展商,展出面积达37,50平米,不仅推动粘合技术的发展,而且,是粘接,绝缘,发泡,密封和封装材料,以及应用设备的制造商和供应商交流的盛会,并在各自的应用技术处理范围内,正变得越来越密切相关了。

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      Bondexpo是全球第一大用户会议场所,通过粘合,成型,密封和发泡,通过连接/粘合的工艺链清晰一致地提供了详细的系统解决方案,用于在最广泛的材料的接合和粘合领域的当前和将来的挑战。在资源节约方面的新要求以及通过材料混合/混合设计实现轻量化结构或微系统技术应用的小型化方面的新要求也是至关重要的。粘合技术供应商找到了从全球化生产世界向专业人士介绍的理想环境。

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      Bondexpo与Motek(国际组装,处理技术和自动化展览会)并行运行。展会集团是一个令人印象深刻的证明,需要考虑箱外,以便能够提供生产和组装技术的工艺链的完整表示,包括通过胶合的基本粘合和连接技术。

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      展品范围(Show Products):

      1、胶粘和密封剂;

      2、有机硅产品;

      3、透明有机硅凝胶粘接,绝缘,发泡,密封和封装材料等。

      展会报告(Show Reports):

      In the autumn of 2023, the traditional Motek/Bondexpo dual trade fair will be one of the highlights of the industry. From 10 to 13 October 2023, the 41st Motek – international trade fair for production and assembly automation – will open its doors together with the 16th Bondexpo – international trade fair for adhesive bonding technology. The focus is on industrial production as a complete system – ranging from the components, assemblies and subsystems to complete systems.

      A clear profile, compelling topics, practical solutions – Motek/Bondexpo provides designers, investors and buyers with everything they need to improve their production and make it more profitable. Suppliers and users will meet and discuss practical, feasible solutions in the usual down-to-earth working atmosphere. By tradition, Motek/Bondexpo is a trade event that focuses on a specific topic. It covers the entire process chain for cost-effective production and assembly automation – from components and assemblies to subsystems and complete systems.

      Try out cobots at first hand

      Exhibitors and trade visitors alike appreciate that “We are in a decade of transformation – and automation is proving to be a decisive tool for leveraging this change. Which is why we are all the more pleased to use Motek as a major platform for presenting our extensive product range and our latest innovations for flexible production”, says Jörg Rommelfanger, Head of ABB’s Robotics Division in Germany. The robotics specialist will be presenting the new GoFa cobots to industry visitors. ABB will also present their Partner Ecosystem for providing plug-and-play packages for all ABB robots and machine safety solutions from their Electrification business unit. The exhibitor also pointed out that the cobots shown at Motek will encourage visitors to touch them and try them out: “All visitors will have the opportunity to leave our booth as a cobot programmer”, promises Rommelfanger.

      Outstanding platform for technical discussions and business success

      The Motek/Bondexpo is also a must for the company Rodriguez from Eschweiler, Germany. “Motek is an important industry gathering for us. We look forward to the technical discussions and the mutual exchange of ideas and innovations on the market”, says Gunther Schulz, Managing Director of Rodriguez. The supplier of thin-section and special bearings will present a number of trade fair highlights from the fields of precision bearings and linear technology in Stuttgart. Martin Mechanic from Nagold in the Black Forest will also be among the exhibitors. “For us as mechanical engineers, Motek is always a great opportunity to talk about new projects”, affirms Claus Martin, Managing Director of Martin Mechanic. “Good conversations and interesting enquiries often develop into lasting business relationships. Motek has contributed to our success for many years.”

      Three main topics form this year’s theme

      “Motek, along with the fully integrated Bondexpo, takes a holistic view of manufacturing processes – from the component to the complete plant”, explains Motek project manager Rainer Bachert. “In line with the pragmatic, practical orientation and dependably clear theme of the trade fair, we are focussing this year on three pillars – networked, intelligent production components, assembly support systems and solutions for easy implementation and commissioning. All the technological innovations of the past few years will be represented with practical examples – increasing digitalisation and networking of production components, the boom in intelligent assembly and assembly support systems and plug-and-play solutions for immediate implementation and commissioning of systems. “Software, simulation and AI-supported processes permeate all three main topics”, explains the project manager. “The aim in all areas is to make production more efficient, safer, more reliable and more economical. A common thread running through all areas is resource conservation and sustainability. These are huge fields of activity and pose immense challenges that have to be overcome by the manufacturing companies. Motek will present practical approached to our industry visitors.” The Motek/Bondexpo trade fair concept shows companies from all sectors how to get started with the automation and digitalisation of products and processes. “The trade fair combines pragmatism, practicality and future viability”, observes Bettina Schall, Managing Director of trade fair organiser P. E. Schall. “We’re looking forward to the personal communication between experts from the industry and cordially invite all suppliers and users of modern production automation to this year’s Motek/Bondexpo, which will be held from 10 to 13 October 2023 and 8 to 11 October 2024 in Stuttgart.”

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