2024年美国国际粉末冶金及材料技术展览会

美国国际粉末冶金及材料技术展览会(PowderMet)北美举行的粉末冶金和金属增材制造技术的首要展览及会议活动，该展由金属粉末工业联合会（metal Powder Industries Federation - MPIF）主办，一年一届，在美国各城市轮流举行。PowderMet是美洲领先的粉末冶金和颗粒材料技术会议，是行业各个领域专业人士的技术转让中心，包括金属粉末、工具和压实机、烧结炉、炉带、粉末处理和混合设备、质量控制和自动化设备、粒度和粉末表征设备、咨询和研究服务等的买家和指定人。

PowderMet是参加专门致力于粉末冶金、颗粒材料和金属增材制造的PM行业最大的贸易展览会。这个国际展览将有100多个展位，展示领先的公司，展示最新的PM和金属AM设备、粉末、产品和服务。这是在一个地方与行业供应商会面的最佳机会。

同时举行的AMPM会议专注于金属增材制造技术，将邀请全球行业专家介绍这一快速增长领域的最新技术发展。

每年主办方MPIF都会在世界上首屈一指的粉末冶金和颗粒材料技术会议PowderMet期间赞助一场贸易展，该会议与AMPM（粉末冶金增材制造会议）联合举行。参加展览的有来自行业各个领域的专业人士，包括金属粉末、工具和压制机、烧结炉、炉带、粉末处理和混合设备、质量控制和自动化设备、粒度和粉末表征设备、咨询和研究服务等的买家和指定人。

由金属注射成型协会联合主办的金属、陶瓷和碳化物注射成型国际会议也每年举行一次，并以桌面展览为特色，非常适合分享您的公司的技术创新。如果您的客户在广泛的粉末冶金行业中占据任何利基市场，您就不能错过这些强大的营销机会。有关在任何技术会议上展示贵公司产品和服务的完整详细信息，

展品范围(Show Products):

粉末制造及加工：喷雾、合金化技术、抗离析处理、机械合金化、粉末的性能表征、热喷涂粉末、粉末直接应用；

粉末压制：建模、压缩、暖模具成形、高速压实、复杂几何零件冲压、粉末压实新概念、模具填充、润滑剂、模壁润滑；

烧结：建模、尺寸控制、自蔓延反应烧结SHS、微波烧结、感应烧结、放电等离子烧结、烧结硬化 、渗透、大气和大气控制、筑炉新概念；

全密度与另类合并：粉末锻造、喷射成形、静压、热压、挤压、快速原型制造、压成型、湿粉喷雾流延；

粉末注射成型：建模 、新粘结剂系统、中压的PIM、改进的形状和公差、PIM复方与复合材料部件、填隙控制、微型PIM；

PM小型化及纳米技术：纳米粉体的制备、纳米粉体整理、纳米粉末冶金、纳米粉末冶金零件、纳米粉体处理；

辅助及精加工业务：加工及绿色加工、表面精密化、加入、表面保护/防腐蚀、镀层后处理、热处理、其他处理方法；

PM工具改进：建模和仿真、微观结构表征、原位-表征+过程控制、微观分析、工艺与质量控制、标准化、设计，测试与评估 ；

烧结钢：力学性能、表面性质、疲劳与耐久性、微结构、低合成金钢、新合金化系统、不锈钢；

PM有色金属及特殊材料：高温合金、难熔金属、铜及PM铜、摩擦材料、金属间化合物、重型合金；

PM质地轻盈，多孔材料：PM铝及镁、PM钛、金属泡沫材料、过滤器、轴承；

PM生物材料：钛，钽，锆，钴铬合金、PM复合材料的生物功能、PM抗菌材料、接口硬盘和软组织；

PM刀具材料：硬质合金、金属陶瓷、PM工具钢、金刚石工具、其他硬物；

PM功能材料：磁性材料、电气及电子材料、导热导电材料、多收缩及功能梯度材料、金属陶瓷复合材料、形状记忆合金；

粉末冶金应用的现状与未来：汽车、航天、电气/电子、电动工具、切削工具、电力与能源科技、电信、（生物）医学、住户、体育、环境。

展会报告(Show Reports):

The leading technical conference on powder metallurgy and particulate materials in the Americas, PowderMet2024 is a hub for technology transfer for professionals from every part of the industry, including buyers and specifiers of metal powders, tooling and compacting presses, sintering furnaces, furnace belts, powder handling and blending equipment, quality-control and automation equipment, particle-size and powder-characterization equipment, consulting and research services, and much, much more.

Attend the PM industry’s largest tradeshow devoted exclusively to powder metallurgy, particulate materials, and metal additive manufacturing. With over 100 booths, this international marketplace will present leading companies featuring the latest PM and metal AM equipment, powders, products, and services. This is the best opportunity to meet industry suppliers all together in one place.

Poster authors will be on hand to discuss their posters during the PM Evening Alehouse. We will also recognize the Poster Award Winners. The Poster authors will also present their poster throughout the conference during the Grant TNT: Talk ‘N Technology.

All entries will be on display in the exhibit hall, with winning parts to be identified following Tuesday's The Design Experience. This “Showcase of PM, MIM and AM Excellence" provides an opportunity to review the latest engineering innovations and applications.

Each year, MPIF sponsors a trade exhibition during the world's premier technical conference on powder metallurgy and particulate materials, PowderMet, which is held in conjunction with AMPM, the Additive Manufacturing with Powder metallurgy conference. The exhibit is attended by professionals from every part of the industry, including buyers and specifiers of metal powders, tooling and compacting presses, sintering furnaces, furnace belts, powder handling and blending equipment, quality-control and automation equipment, particle-size and powder-characterization equipment, consulting and research services, and much, much more.

The International Conference on Injection Molding of metals, Ceramics and Carbides, co-sponsored by the metal Injection Molding Association, is also held annually and features a tabletop exhibition perfect for sharing your companies technological innovations. If your customers occupy any niche within the broad powder metallurgy industry, you can't afford to be absent from these powerful marketing opportunities. For complete details on exhibiting your company's products and services at any technical conference.